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11th IEEE International Conference on Advanced Thermal Processing of Semiconductors

RTP 2003

September 23 - 26, 2003

The Westin Francis Marion Hotel,

Charleston, SC

IEEE Catalog Number:03EX696
ISBN:0-7803-7874-1
Library of Congress:2003103049

 

 

Thermal Performance Challenges for Rapid Thermal Processing
J. Hebb, Axcelis

KrF Excimer Laser Annealing for Ultra Shallow Junction Formation: Approach for Irradiation Energy Density Reduction
K. Shibahara, K. Kurobe, Y. Ishikawa, K. Kagawa, Y. Niwatsukino, A. Matsuno, Hiroshima University

Challenges for Ultra Shallow Junction Formation Technologies Beyond the 90nm Node
P.J. Timans, W. Lerch, J. Niess, S. Paul, N. Acharya, Z. Nenyei, Mattson Technology

Overview of NIST Metrology Development for the Semiconductor Industry
S. Knight, NIST, Gaithersburg

Rapid Thermal Growth of Silicon Nitride Films
I. Eisele, A. Ludsteck, Bundeswehr University, Neubiberg, Z. Nenyei, Mattson Technology

Advantages of in-situ RTP for the Fabrication of Metal/high-dielectric Constant Gate Dielectric Stack for sub 90 nm CMOS Technology
D. Damjanovic, K.F. Poole, R. Singh, Clemson University

Flash Thermal Processing Through the Melting Point of Silicon
J. J. Cibere, S. P. McCoy, D. Camm, G. Stuart, K. Elliott, Vortek Industries

Continuity in Development of Ultra Shallow Junctions for 135-45 nm CMOS: The Tool and Annealing Methods
V.I. Kuznetsov, A.J.M.M. van Zuthpen, H. R. Kerp, P. G. Vermont, X. Pages, J.J. van Hapert, K. van der Jeugd, E.H.A. Granneman, ASM International, Bilthoven

Heat Transfer in Product Patterned Silicon Semiconductor Substrate
B. Lojek, Atmel Corporation

Traceable Emissivity Measurements in RTP Using Room Temperature Reflectometry
A. Hunter, B. Adams, R. Ramanujam, Applied Materials, Santa Clara

Use of Optical Fiber Thermometer in High Temperature Environments
M. R. Jones, D. G. Barker, Birgham Young University, Provo

Traceable Temperature Calibrations of Radiation Thermometers for Rapid Thermal Processing
Benjamin K. Tsai, NIST, Gaithersburg

Study of the Radiative Properties of Silicon-Based Materials for Thermal Processing and Control
Z.M. Zhang, B.J. Lee, H.J. Lee, Georgia Institute of Technology

Thin Film and Emissivity Effects on Radiometric Temperature Measurement Accuracy
J. Bodycomb, I Ferguson, Bellwether Instruments, Columbia

Light Pipe Proximity Effects on Si Wafer Temperature in Rapid Thermal Processing Tools
K. G. Kreider, D.H. Chen, D. P. DeWitt, W.A. Kimes, and B.K. Tsai, NIST Gaithersburg

Temperature Dependent Emissivity Metrology Development at NIST in Support of RTP Needs
L. M. Hanssen, V. Khromchenko, S. N. Mekhontsev, NIST

Developing of Experimentally Validated Optical Property Models
B.J. Lee, Z.M. Zhang, Georgia Institute of Technology

In-Situ Steam Generation for Shallow Trench Isolation in Sub-100nm Devices
Hali J.L. Forstner, F. Nouri, C. Olsen, Applied Materials, Sunnyvale

A novel method for RTP low temperature monitor
C. H. Chang, M. F. Hsieh, T. W. Liu, J. T. Lin, UMC Hsin-Chu City

Study of the activation of low energy implanted-Arsenic annealed in pure N2 in a large range of annealing temperatures from 650°C to 1100°C
R. El Farhane, M. Müller, Philips, A. Halimaoui, F. Wacquant, ST Microelectronics, Crolles, C. Laviron, LETI-CEA, Grenoble

Sensor Location, Lamp Grouping, Identification, and Multivariable Iterative Learning Control of an RTP Process for Maximum Uniformity of Wafer Temperature Distribution
M. Cho, Conwell Co., LTD., S. Joo, Kornic Systems Co., LTD., Yonghee Lee, and Kwang Soon Lee, Sogang University

Batch Reactor Design Optimization Using Computational Fluid Dynamics
Dynamics S. Mokhtari, J. Bailey, ASML Thermal Division, Scotts Valley

New Directions in Thermal Batch Processing
R. Herring, T. Lazerand, C. Porter, ASML Thermal Division, Scotts Valley

Design of Halogen Lamps for Rapid Thermal Processing
J. M. Ranish, Applied Materials, Santa Clara

An Examination of Athermal, Photonic Effects on Boron Diffusion and Activation During Microwave Rapid Thermal Processing
C.J. Bonifas, K. Thompson, J.H. Booske, R.F. Cooper, University of Wisconsin, Madison

RTP of Titanium Boride for Applications in Front End Processing
W. Zagodzon-Wosik, R. Ranjit, I. Rusakova, P. van der Heide, Z. Zhang, University of Houston, J. Bennett, Int. Sematech

Reflectivity of the Silicon Semiconductor Substrate and its Dependence on the Doping Concentration and Intensity of the Irradiation
B. Lojek, Atmel Corporation