2nd International Rapid Thermal Processing Conference
RTP 1994
August 31 - September 2, 1994
Monterey Marriott
Monterey, California
PLENARY SESSION
Process Requirements Through 2001.
A.R. Alvarez, Cypress Semiconductors
RTP Tools Development Requirements.
F. Robertson, D. Lindholm, Sematech
Fundamentals and Applications of Radiative Heat Transfer: Implications for RTP.
J.R. Howell, K.S.Ball, T.L.Bergman, University of Texas
Photons in Semiconductors: Absorption and Lattice Heating.
B. Lojek, AMD
PROCESS INDUCED DEFECT IN SEMICONDUCTORS
Techniques and Application of Deep Level Transient Spectroscopy to Rapid Thermal Processed Silicon.
J. Benton, Bell Laboratories, Murray Hill
Electrical Properties of RTA Induced Defects in Silicon.
E. Susi, A. Poggi, M.Madrigali,
Istituto LAMEL -CNR
Application of Surface Photovoltage Technique for In-line IC Process Monitoring.
K. Nauka, Hewlett-Packard
Characterization of Advanced Thermal Processing by the Magic Mirror.
P. Blaustein, M. Bevins, Hologenix,
Transient Deformation of Silicon Wafers During Insertion/Withdrawal into/from Horizontal Furnaces.
M. Itsumi, NTT
Influence of End-Of-Range Defects Density on the Electrical Properties of P+/N Junctions Formed by Boron Implantation into Ge-Preamorphized Si Substrate.
A. Martinez, C. Bergaud, LAAS/CNR, M. Minondo, C. Jassaud, LETI,
L. Laanab, A. Claverie, CEMES-LOE/CNRS
RTA Induced Overlay Errors in a Global Alignment Stepper Technology.
J.F. Buller, M.Farahani, S.Garg, AMD
ADVANCED PROCESSING I
Implant Activation in GaAs Using RTA.
R. S. Christ, TriQuint Semiconductor
In Situ Rapid Thermal Multi-processing Using SiH2Cl2/NH3 RTCVD to form High Density DRAM Nitride Capacitor Dielectrics.
K. Ando, H.Watanabe, H.Ono, NEC
Rapid Thermal Densification of Ultra-Thin LPCVD TEOS SiO2 for Sub-Half Micron Device Applications.
K.G. Reid, T.P. Ong, B-Y.Nguyen, T.C. Mele, P.J. Tobin,D.K. Weddington, Motorola
Surface Insensitive Open-Loop Processing with Furnace RTP.
A. Wittkower, C. Lee, High Temperature Engineering
Epitaxial Growth of Silicon-Based Heterostructures by Low Temperature Rapid Thermal Chemical Vapor Deposition.
J.C. Sturm, P.V. Schwartz, Princeton University,
Low-Temperature Silicon Epitaxy in an Ultra-High Vacuum Rapid Thermal Chemical Vapor Deposition Reactor with Disilane and Hydrogen.
K.E. Violette, M.K. Sanganeria, M.C. Ozturk,S. Muhsin,G. Harris, A. Lee, D. M. Maher, North Carolina State University
RTP EQUIPMENT
Rapid Thermal Processor with Dynamic Spatial Control and Emissivity-Independent Temperature Sensing.
G. Miner, C. Gronet, B. Peuse, J. Grilli, Applied Materials
Three Zone Rapid Thermal Processor System.
W.J. Kiether, M.J.Fordham, S.Yu, A.J. Silva Neto,K.A. Conrad, J.R. Hauser, F.Y.Sorrell, J.J.Wortman, North Carolina State University
The Influence of Wavelength-Dependent Radiation in Simulation of Lamp-Heated Rapid Thermal Processing Systems.
A. Ting, Sandia National Laboratories
Radiation Incidence Engineering in Rapid Thermal Processing.
Z. Nenyei, A. Tilmann, J. Gelpey, AST Elektronik
In-Situ Characterization of a Rapid Thermal Processor.
F. Trapp, AIRCO, P. Carr, BOC Group
A Design Methodology for Configuration of Lamps in an RTP System.
S. Belikov, H. Martynov, M. Kaplinski, C. Manikopoulos,
N. Ravindra, W. Kosonocky, New Jersey Institute of Technology
Cluster Tool RTP Gate Stack Deposition and In-Situ Treatment.
A.M. Bayoumi, J.R. Hauser, North Carolina State University
Advanced Model Based Equipment Control for Rapid Thermal Processing.
A. Tillmann, AST Elektronik, J. Cuchiaro, NCR
The Application of Computational Simulation to Design Optimization of an Axisymetric Rapid Thermal Processing System.
P.A. Spence, W.S.Winters, R.J. Kee, Sandia National Laboratories,
A. Kermani, CVC
Modeling of Radiation Heat Transfer and Wafer Temperatures in a Complex Three-Dimensional Rapid Thermal Processing Chamber.
K.L. Knutson, T.P. Merchant, J.V. Cole, J.P. Hebb,
T.G. Mihopoulos, K.F. Jensen, MIT
Advances in Modeling RTP Processes Using Unstructured Solution-Adaptive Meshes.
J.Y. Murthy, D.Choudhry, M. Missaghi, J. Maruszewski, FLUENT
Consideration of Photoeffects in the Design of Rappid Thermal Processing Systems
R. Singh, R. Sharangpani, S. Alamgir, Clemson University
Formation of Viable Nuclei and Particle Growth in HydrothermalProcessing of Silicon Dioxide Wafers: A modeling study of entrance effects.
S.M.Chitanvis, Los Alamos National Laboratory
TEMPERATURE MEASUREMENT
Ultrasonic Temperature Measurement in RTP.
F.L.Degertekin, P.E. Roche, B.V. Honein, J. Pei,
B.T. Khuri-Yakub, K.C. Saraswat, Stanford University
Reflectance Pyrometry in RTP Machines.
A. Stein, Quantum Logic
Measurement of the Wafer Temperature with Ultrafast Thin Film Thermocouple.
B. Lojek, AMD
The Effect of Coatings on the Emissivity of Silicon.
P.J. Timans, Cambridge University
The Wafer Temparature Measurement in Dual OH-Band Quartz Tube.
H. Walk, T. Theiler, AST Elektronik
OXIDATION AND RTPCVD
In-Situ Rapid Thermal Processes for Formation of High Quality Gate Stacks.
J.J. Wortman, V. Misra, W.K. Henson,
North Carolina State University
Rapid Thermal Oxides: Processing and Electrical Properties.
R. Henda, E. Scheid, P. Temple-Boyer, G. Sarrabayrouse,
A.Martinez, LAAS-CNR
Combined Plasma and Rapid Thermal Processing for Advanced Dielectric Formation - Application to Ultra-Thin Oxide-Nitride-Oxide (ONO) and Oxynitride Materials.
G. Lucovsky, Y. Ma, Z. Lu, S.V. Hattangady, S.Gandhi, H. Nimi, North Carolina State University
Integration of 80A N2O Furnace Annealed Gate Oxide into a 0.35um CMOS Process.
W. M. Greene, F. Perlaki, Hewlett Packard
Growth Kinetics and Electrical Performance of Silicon Oxide Layer Grown by RTP in Pure N2O Ambient.
P. Lange, E. Hartmannsgruber, F. Naumann, Fraunhofer Institute
Rapid Thermal Deposition of Nitrogen Doped Silicon from Silane and Amonia.
P.Tample Boyer, E. Scheid, F.Olivie,E.Campo, LAAS-CNRS
Native Oxide Etching Study During Rapid Thermal Processing.
M. Alessandri, G. Ferroni, G.Queirolo, A. Rebora, SGS-Thompson
PERSPECTIVE PROCESSING OF SEMICONDUCTORS
Projection Gas Immersion Laser Doping (P-GILD): A Resistless, Nanosecond Thermal Doping/Diffusion Technology.
K. Weiner, Lawrence Livermore National Laboratory
Rapid Heating of Poly-Si Films by a Gas Flame.
Y. Masaki, M.Suzumi, W.F. Qu,Y. Kakimoto, A. Kitagawa, M. Suzuki, Kanazawa University
Rapid thermal Magnetic Annealing of Amorphous and Nanocrystalline Soft-Magnetic Alloys.
F. Roozeboom, F.W.A. Dirne, Phillips Research
Optical Processing Involving Photon-Enhanced Interface Reactions.
B. L. Sopori, National Renewable Energy Laboratory
Non-Contact Sheet Resistance Measurement for RTP Cluster Tools.
K. Kempa, R. Litovsky,P. Becla, EXID, B. Lojek, AMD
High Power Arc-Lamp RTP System for High Temperature Annealing Application.
D. M. Camm, Vortek Industries, B. Lojek, AMD
PROCESS CONTROL
Overview of Process Control Issues in Rapid Thermal Processing.
T. Edgar, University of Texas, T.Breedijk, TI
Feedforward Learning Methods in RTP Temperature Control.
K.M. Tao, G. Aral, R.L. Kosut, M. Ekblad, Integrated Systems
Dynamic Model Identification, Sensor Processing and Feedback Control of RTP Processes with Strong Nonlinearities.
M.K. Ekblad, H.N. Tominaga, Integrated Systems
Concurrent Engineering of an RTP Reactor: Design and Control
G. Aral, Integrated Systems, T.P. Merchant, J.V. Cole, K.L. Knutson, K.F. Jensen
Robust Control of Thermal Processes: Static Performance.
R.L.Kosut, M.G. Kabuli, Integrated System
Advanced Control of a Polysilicon Deposition Processes in a Vertical Batch Furnace.
S. Shah, P.Pandey, RelMan, C. Ramiller, SEMITHERM, W. Houf,
Sandia National Laboratory, G. Costrini, SEMATECH
ADVANCED PROCESSING II
Ultra Shallow Junction Formation Using Low Temperature Deposition Techniques for the Dopant Sources.
W.Zagodzon-Wosik, M.Davis, N. Chowdhury, F.Romero-Borja,B.-H. Zhang, P. Grabiec, J. Kulig, D.Pan, G. Lux,
University of Houston
Process Repeatability in Open-Loop Rapid Thermal Processing.
H.J. Timme, Siemens, T.Nguyen, A. Ajmera, IBM
RTP Anneal For High Dose Ion Implantation Monitoring.
J. Shi, R. J. Bradley, L.A. Larson, Sematech
InSitu Post Deposition Anneal of Rapid Thermal Chemical Vapor Deposited Titanium Nitride.
B. Froschle, R. Leutenecker, U. C. Minh, P. Ramm, Fraunhofer Institute
Silicide Processing Using a Continous Heat Source RTP.
C. Lee, A. Wittkower, High Temperature Engineering
Wafer Temperature Mapping for Process Optimization in Rapid Thermal Processing Systems.
R.P.S. Thakur, Micron Semicondustor,
W. Renken, SensArray