The RTP Conference Committee and IEEE invite you to submit abstracts for the 18th Annual IEEE Conference on Advanced Thermal Processing of Semiconductors - RTP2010. This conference will be held in Hilton University of Florida Conference Center in Gainesville on September 28 to October 1, 2010. The conference provides an opportunity for members of the RTP community and academia to share their insight and learn more about Advanced Thermal Processing of Semiconductors. The conference brings together process and equipment engineers, managers, researchers and educators involved in Advanced Thermal Processing of Semiconductors.

The Conference is accompanied by a one day tutorial workshop which will be held on September 28, 2010.

The committee invites leaders in the semiconductor industry to submit papers based on all aspects of Thermal Processing of Semiconductors.


Important Dates:

Abstract Submission Deadline May 31, 2010
Abstracts Review Period June 1, 2010 - June 14, 2010
Notification of Acceptance June 14, 2010
Final Paper Submission Deadline: August 31, 2010



CALL FOR PAPERS

18th IEEE Conference on Advanced Thermal Processing of Semiconductors

IEEE RTP 2010

Hilton University of Florida Conference Center in Gainesville
September 28 - October 1, 2010


Conference Chair:
Bo Lojek
ATMEL

Regional Chairs:
EuropeAmericaFar East
Erik RosseelJeff GelpeyMasayasu Tanjyo
IMECCentrotherm Thermal SolutionsNissin Ion Equipment

IEEE RTP'2010 is a conference for engineers, scientists, managers and marketing specialists working in thermal processing of semiconductors, manufacturing, simulation and equipment development. The goal is to provide a comprehensive overview of current and future directions of thermal processing technology and processing systems. The primary emphasis will be on the state-of-the-art tools and RTP and Furnace concepts and methods as they apply to commercial ULSI processing. Papers are sought in the following areas:

  • Thermal Processing of Nanomaterials and Nanostructures
  • Advanced Dielectric Formation and RTPCVD
  • Diffusion, Dopant Activation and Junction Formation
  • Application of Thermal Processes to Front and Back End Manufacturing
  • RTP and Advanced Thermal Processing Equipment
  • Temperature Measurement and Control
  • Heat Transfer in Microstructures
  • Modeling and Simulation of Thermal Processes
  • Strategies for RTP and Furnace Processing in the Manufacturing Environment


    All submissions should include title, list of authors with affiliations, and an abstract not exceeding 300 words. Abstracts should be submitted electronically as a Microsoft Word or Adobe PDF document. To submit a paper, please follow instructions in the folder Submit Abstract. Accepted papers will be published in the archival conference proceeding, with no page limit.

    DEADLINE FOR ABSTRACT SUBMISSIONS IS MAY 31, 2010.

    All correspondence should be addressed to any member of the Conference Steering Committee or to:

    IEEE RTP 2010 Conference
    http://www.IEEE-RTP.org